Datasheet

Device Insertion

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3 Device Insertion

For proper SMV512K32-CVAL breakout-board operation, the 76-pin HFG package must be inserted into

the socket carefully with the correct orientation. See highlighted red dots in figure 3 for correct orientation.

The device has small gold circle embedded into the ceramic in one corner. The socket has an embossed

triangle.

To insert the device, place device with correct orientation in the socket. When properly aligned, press

down on all four corners of the socket frame to allow cantilever pins to expand and allow device to seat

and be captured properly.

4 Schematics

4.1 Element Schematics

The schematic for the SMV512K32-CVAL breakout-board is shown on the following page in Figure 4.

SMV512K32-CVAL SRAM Breakout Evaluation Board SLVU571– January 2012

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