Datasheet

Example: 2 to 3
Battery Cells
V
DD
Supply
(+1.6V to +5.5V)
GND
V
DD
OVERTEMP
OVERTEMP
V
TEMP
TRIP TEST
Microcontroller
SM72480
Analog
ADC Input
V
DD
GND
V
SENSE
GND
V
DD
GND
SM72480
www.ti.com SNIS156C –NOVEMBER 2010–REVISED APRIL 2013
PIN DESCRIPTIONS (continued)
Pin
Name Type Equivalent Circuit Description
No.
Over Temperature Switch output
Active High, Push-Pull
Digital
5 OVERTEMP Asserted when the measured temperature exceeds the Trip Point
Output
Temperature or if TRIP TEST = 1
This pin may be left open if not used.
Over Temperature Switch output
Active Low, Open-drain (See OVERTEMP OPEN-DRAIN DIGITAL
Digital OUTPUT regarding required pull-up resistor.)
3 OVERTEMP
Output Asserted when the measured temperature exceeds the Trip Point
Temperature or if TRIP TEST = 1
This pin may be left open if not used.
V
TEMP
Analog Voltage Output
If TRIP TEST = 0 then
Analog V
TEMP
= V
TS
, Temperature Sensor Output Voltage
6 V
TEMP
Output If TRIP TEST = 1 then
V
TEMP
= V
TRIP
, Temperature Trip Voltage
This pin may be left open if not used.
4 V
DD
Power Positive Supply Voltage
2 GND Ground Power Supply Ground
The best thermal conductivity between the device and the PCB is achieved
by soldering the DAP of the package to the thermal pad on the PCB. The
DAP Die Attach Pad thermal pad can be a floating node. However, for improved noise immunity
the thermal pad should be connected to the circuit GND node, preferably
directly to pin 2 (GND) of the device.
Typical Application
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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