Datasheet

SM72238
SNVS694C –JANUARY 2011–REVISED APRIL 2013 www.ti.com
Connection Diagrams
Front View
Figure 2. PFM Package
See Package Number NDP0003B
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Input Supply Voltage −0.3 to +30V
Power Dissipation Internally Limited
Junction Temperature (T
J
) +150°C
Ambient Storage Temperature −65° to +150°C
Soldering Dwell Time, Temperature Wave 4 seconds, 260°C
Infrared 10 seconds, 240°C
Vapor Phase 75 seconds, 219°C
ESD Rating Human Body Model
(3)
2500V
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and
associated test conditions, see the Electrical Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) Human Body Model 1.5kΩ in series with 100pF.
Operating Ratings
(1)
Maximum Input Supply Voltage 30V
Junction Temperature Range, (T
J
)
(2)
−40° to +125°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and
associated test conditions, see the Electrical Characteristics tables.
(2) Junction-to-case thermal resistance for the PFM package is 5.4°C/W.
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