Car Stereo System - Car Radio Digital Signal Processor User Manual

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1.1 ZTZ/GTZ BGA Package (Bottom View)
ZTZ/GTZ 697-PIN BALL GRID ARRAY (BGA) PACKAGE
(BOTTOM VIEW)
A
2
B
1 3
4
5
6
7
8
9
10
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12
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C
D
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J
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M
N
P
R
T
U
V
W
Y
AA
AB
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AD
AE
AF
27
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AG
AH
AJ
NOTE: The ZTZ mechanical package designator represents the version of the GTZ package with lead-free balls. For more detailed information,
see the Mechanical Data section of this document.
1.2 Description
SM320C6455-EP
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS462B – SEPTEMBER 2007 – REVISED JANUARY 2008
• System PLL and PLL Controller Boundary-Scan-Compatible
• Secondary PLL and PLL Controller, Dedicated • 697-Pin Ball Grid Array (BGA) Package
to EMAC and DDR2 Memory Controller (ZTZ or GTZ Suffix), 0.8 mm Ball Pitch
• Advanced Event Triggering (AET) Compatible • 0.09 µ m/7-Level Cu Metal Process (CMOS)
• Trace-Enabled Device • 3.3/1.8/1.5/1.25/1.2 V I/Os, 1.25/1.2 V Internal
• IEEE-1149.1 ( JTAG™)
Figure 1-1 shows the SM320C6455-EP device 697-pin ball grid array package (bottom view).
Figure 1-1. ZTZ/GTZ BGA Package (Bottom View)
The C64x+™ DSPs (including the SM320C6455-EP device) are the highest-performance fixed-point DSP
generation in the C6000™ DSP platform. The C6455 device is based on the third-generation
high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture developed by
Texas Instruments (TI), making these DSPs an excellent choice for applications including video and
telecom infrastructure, imaging/medical, and wireless infrastructure (WI). The C64x+™ devices are
upward code-compatible from previous devices that are part of the C6000™ DSP platform.
Based on 90-nm process technology and with performance of up to 9600 million instructions per second
(MIPS) [or 9600 16 bit MMACs per cycle] at a 1.2-GHz clock rate, the C6455 device offers cost-effective
solutions to high-performance DSP programming challenges. The C6455 DSP possesses the operational
flexibility of high-speed controllers and the numerical capability of array processors.
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