Datasheet
User's Guide
SBOU076 – September 2008
Serial-Bus Evaluation Module
This user’s guide describes the characteristics, operation, and the use of the Serial-Bus-EVM evaluation
module. It provides a detailed description of the hardware configuration. The Serial-Bus-EVM is a
general-purpose tool used to generate I
2
C™, SPI™, and general-purpose digital input/output (I/O) data.
The EVM contains a solderless breadboard for prototyping circuits. A common typical application for this
tool is to communicate with temperature sensors over an I
2
C or SPI connection.
Contents
1 Overview ...................................................................................................................... 2
2 System Setup ................................................................................................................ 4
3 Serial-Bus-EVM Hardware Setup .......................................................................................... 4
4 Script Editor Software Overview.......................................................................................... 13
5 Bill of Materials ............................................................................................................. 15
List of Figures
1 Hardware Included with the Serial-Bus-EVM ............................................................................ 3
2 USB DIG Platform Hardware Setup ....................................................................................... 4
3 Connecting the Two EVM PCBs ........................................................................................... 5
4 Connecting Power to the EVM ............................................................................................. 6
5 Connecting the USB Cable ................................................................................................. 7
6 Interface Test Board Signal Connections ................................................................................. 8
7 Interface Test Board Banana Jack and Terminal Strip Connections ................................................. 9
8 Interface Test Board Test Points and Ground Connection ........................................................... 10
9 Unshielded Cable and Associated Problems ........................................................................... 11
10 Cable Design with Shield (Eliminates Capacitive Coupling Between Cables) ..................................... 12
11 Shielded Cable Build on Solder Cup D-Sub ............................................................................ 12
12 tioScript Editor Software Access—Properly Installed .................................................................. 13
13 tioScript Editor Window .................................................................................................... 14
Microsoft, Windows are registered trademarks of Microsoft Corporation.
SPI is a trademark of Motorola, Inc.
I
2
C is a trademark of NXP Semiconductors.
All other trademarks are the property of their respective owners.
SBOU076 – September 2008 Serial-Bus Evaluation Module 1
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