Datasheet

Prefix: TM
S = Fully TMS Qualified
P = TMP Prototype
X = TMX Samples
Core Technology:
5 = 570 Cortex R4
Architecture:
LS = Lockstep CPUs
Flash Memory Size:
20 = 2MB
10 = 1MB
RAM Memory Size:
2 = 160kB
1 = 128kB
Peripheral Set:
16 = FlexRay
06 = No FlexRay
Die Revision:
Blank = Initial Die
A = 1st Die Revision
B = 2nd Die Revision
Technology/Core Voltage:
S = F035 (130nm), 1.5 V nominal core voltage
Package Type:
PGE = 144p QFP Package [Green]
ZWT = 337p BGA Package [Green]
Temperature Range:
Q = -40...+125 C
o
Quality Designator:
Q1 = Automotive
Shipping Options:
R = Tape and Reel
Full Part # TMS 570 LS 20 2 16 A S PGE Q Q1 R
Orderable Part # S 5 LS 20 2 16 A S PGE Q Q1 R
TMS570LS20216, TMS570LS20206, TMS570LS10216
TMS570LS10206, TMS570LS10116, TMS570LS10106
SPNS141F–AUGUST 2010– REVISED JULY 2011 www.ti.com
A. For actual device part numbers (P/Ns) and ordering information, see the TI website (http://www.ti.com).
Figure 2-9. Device Numbering Conventions
(A)
36 Device Overview Copyright © 2010–2011, Texas Instruments Incorporated
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TMS570LS10106