Datasheet
TMS570LS20216, TMS570LS20206, TMS570LS10216
TMS570LS10206, TMS570LS10116, TMS570LS10106
www.ti.com
SPNS141F–AUGUST 2010– REVISED JULY 2011
Table 2-9. Terminal Functions (continued)
Terminal
Internal
TMS570LSXXX16 TMS570LSXXX06 Type pullup/p Description
Name
ulldown
337 144 337 144
Supply Voltage Digital I/O (3.3V) and Core (1.5V)
V
CCIO
F6 1 F6 1
V
CCIO
F7 15 F7 15
V
CCIO
F11 40 F11 40
V
CCIO
F12 90 F12 90
V
CCIO
F13 108 F13 108
V
CCIO
F14 119 F14 119
V
CCIO
G6 132 G6 132
V
CCIO
G14 G14
V
CCIO
H6 H6
V
CCIO
H14 H14
V
CCIO
J6 J6
Digital I/O supply pins
Note: All VccIO pads are connected to
V
CCIO
L14 L14
3.3V
the BGA packages through the package
PWR
V
CCIO
M6 M6
substrate. There is not a direct ball to
bond pad connection for this supply.
V
CCIO
M14 M14
V
CCIO
N6 N6
V
CCIO
N14 N14
V
CCIO
P6 P6
V
CCIO
P7 P7
V
CCIO
P8 P8
V
CCIO
P9 P9
V
CCIO
P12 P12
V
CCIO
P13 P13
V
CCIO
P14 P14
V
CCIO
V
CC
F9 19 F9 19
V
CC
F10 31 F10 31
V
CC
H10 37 H10 37
V
CC
J14 47 J14 47
V
CC
K6 87 K6 87
Digital Core supply pins
V
CC
K8 104 K8 104
Note: All Vcc pads are connected to the
1.5V
V
CC
K12 114 K12 114 BGA packages through the package
PWR
substrate. There is not a direct ball to
V
CC
K14 135 K14 135
bond pad connection for this supply.
V
CC
L6 L6
V
CC
M10 M10
V
CC
P10 P10
V
CC
P11 P11
V
CC
Copyright © 2010–2011, Texas Instruments Incorporated Device Overview 33
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