Datasheet

TMS570LS20216, TMS570LS20206, TMS570LS10216
TMS570LS10206, TMS570LS10116, TMS570LS10106
www.ti.com SPNS141F–AUGUST 2010– REVISED JULY 2011
9 Mechanical Packaging and Orderable Information
The following table(s) show the thermal resistance for the PBGA-ZWT and PQFP-PGE mechanical
packages.
9.1 Thermal Data
9.1.1 PGE (S-PQFP-G144) plastic Quad Flat Pack
Table 9-1. PGE (S-PQFP-G144) Thermal Resistance Characteristics
PARAMETER °C / W
R
ΘJA
45
R
ΘJC
5
9.1.2 ZWT (S-PBGA-N337) Plastic ball grid array
Table 9-2. ZWT (S-PBGA-N337) Thermal Resistance Characteristics
PARAMETER °C / W
R
ΘJA
22
R
ΘJC
3.3
9.2 Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). The data is subject to change without notice and without revision of this document.
Copyright © 2010–2011, Texas Instruments Incorporated Mechanical Packaging and Orderable Information 101
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