Datasheet

V
OUT
GND
Enable
1
2
3
6
5
4
C
PUMP+
V
IN
C
PUMP-
V
IN
Enable
3
5
4 6
1
V
OUT
2
GND
Thermal
Control
&
REG71055
C
IN
2.2 µF
C
OUT
2.2 µF
C
PUMP
0.22 µF
REG71055-Q1
SBAS477 – JULY 2009 ....................................................................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
– 40 ° C to 85 ° C TSOT-23 – DDC Reel of 3000 REG71055IDDCRQ1 GIXI
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
DDC PACKAGE
(TOP VIEW)
SIMPLIFIED BLOCK DIAGRAM
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Product Folder Link(s): REG71055-Q1