Datasheet

REG113
11
SBVS031D
www.ti.com
FIGURE 7. Thermal Resistance versus PCB Area for the MSOP-8.
THERMAL RESISTANCE vs PCB COPPER AREA
160
150
140
130
120
110
100
90
80
70
60
Thermal Resistance,
JA
(°C/W)
θ
012345
Copper Area (inches
2
)
Power dissipation depends on input voltage, load condi-
tions, and duty cycle and is equal to the product of the
average output current times the voltage across the output
element (V
IN
to V
OUT
voltage drop):
PVV I
DIN
OUT OUT
=•( – )
(3)
Power dissipation can be minimized by using the lowest possible
input voltage necessary to assure the required output voltage.