Datasheet

REF3312 , REF3318 , REF3320 , REF3325 , REF3330 , REF3333
SBOS392D –AUGUST 2007–REVISED JUNE 2014 www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted).
(1)
MIN MAX UNIT
Input voltage 7.5 V
Voltage
Output voltage 5 V
Current Output short-circuit, I
SC
(2)
180 mA
Operating temperature –50 150 °C
Temperature
Junction temperature, T
J
150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) See the Power-Supply Recommendations section of this data sheet.
7.2 Handling Ratings
MIN MAX UNIT
T
stg
Storage temperature range –65 150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
–4000 4000
Electrostatic
V
(ESD)
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins
(2)
–1000 1000 V
discharge
Machine model (MM) –200 200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted).
MIN NOM MAX UNIT
V
IN
Supply input voltage
(1)
V
OUT
+ 0.2 5.5 V
I
OUT
Output current range –30 30 mA
(1) The minimum supply voltage for the REF3312 is 1.8 V.
7.4 Thermal Information
REF33xx REF3330
THERMAL METRIC
(1)
DCK (SC70) DBZ (SOT-23) RSE (UQFN) UNIT
3 PINS 3 PINS 8 PINS
R
θJA
Junction-to-ambient thermal resistance 279.7 313.1 61.2
R
θJC(top)
Junction-to-case (top) thermal resistance 136.3 144.0 32.6
R
θJB
Junction-to-board thermal resistance 56.9 109.3 16.0
°C/W
ψ
JT
Junction-to-top characterization parameter 11.0 18.2 1.3
ψ
JB
Junction-to-board characterization parameter 56.1 107.9 16.0
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Product Folder Links: REF3312 REF3318 REF3320 REF3325 REF3330 REF3333