Datasheet
®
REF200
2
SPECIFICATIONS
At T
A
= +25°C, V
S
= 15V, unless otherwise noted.
REF200AP, AU
PARAMETER CONDITION MIN TYP MAX UNITS
CURRENT SOURCES
Current Accuracy ±0.25 ±1%
Current Match ±0.25 ±1%
Temperature Drift Specified Temp Range 25 ppm/°C
Output Impedance 2.5V to 40V 20 100 MΩ
3.5V to 30V 200 500 MΩ
Noise BW = 0.1Hz to 10Hz 1 nAp-p
f = 10kHz 20 pA/√Hz
Voltage Compliance (1%) T
MIN
to T
MAX
See Curves
Capacitance 10 pF
CURRENT MIRROR I = 100µA Unless
Otherwise Noted
Gain 0.995 1 1.005
Temperature Drift 25 ppm/°C
Impedance (output) 2V to 40V 40 100 MΩ
Nonlinearity I = 0µA to 250µA 0.05 %
Input Voltage 1.4 V
Output Compliance Voltage See Curves
Frequency Response (–3dB) Transfer 5 MHz
TEMPERATURE RANGE
Specification –25 +85 °C
Operating –40 +85 °C
Storage –40 +125 °C
ELECTRICAL
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
PIN CONFIGURATION
ABSOLUTE MAXIMUM RATINGS
Applied Voltage ..................................................................... –6V to +40V
Reverse Current ........................................................................... –350µA
Voltage Between Any Two Sections................................................. ±80V
Operating Temperature ................................................... –40°C to +85°C
Storage Temperature .....................................................–40°C to +125°C
Lead Temperature (soldering, 10s) .............................................. +300°C
(SOIC 3s)........................................................+260°C
I
I
Substrate
Mirror Input
Low
Low
Mirror Common
Mirror Output
1
2
3
4
8
7
6
5
1
2
High
High
1
2
I
I
Top View DIP/SOIC
PACKAGE
DRAWING TEMPERATURE
PRODUCT PACKAGE NUMBER
(1)
RANGE
REF200AP 8-Pin Plastic DIP 006 –25°C to +85°C
REF200AU 8-Pin SOIC 182 –25°C to +85°C
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book. (2) Grade designation “A”
may not be marked. Absence of grade designation indicates A grade.
PACKAGE/ORDERING INFORMATION
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.