Datasheet
TYPICAL CHARACTERISTICS (32-V INPUT)
(1) (2)
40
50
60
70
80
90
100
Efficiency-%
0 0.5 1 1.5 2 2.5 3
I -OutputCurrent- A
O
V =5V
O
V =3.3V
O
V =12V
O
V =15V
O
V =22V
O
0
0.5
1
1.5
2
2.5
3
P -PowerDissipation-W
D
0 0.5 1 1.5 2 2.5 3
I -OutputCurrent- A
O
V =5V
O
V =3.3V
O
V =12V
O
V =15V
O
V =22V
O
0
50
100
150
200
250
300
V -OutputVoltageRipple-mV
O PP
0 0.5 1 1.5 2 2.5 3
I -OutputCurrent- A
O
V =5V
O
V =3.3V
O
V =12V
O
V =15V
O
V =22V
O
0 0.5 1 1.5 2.52 3
I -OutputCurrent- A
O
20
30
40
50
60
70
80
90
AmbientTemperature-
C°
100LFM
200LFM
AirFlow
V =3.3V
O
AirFlow
100LFM
200LFM
Natconv
0 0.5 1 1.5 2.52 3
I -OutputCurrent- A
O
20
30
40
50
60
70
80
90
AmbientTemperature-
C°
100LFM
200LFM
AirFlow
V =5V
O
AirFlow
100LFM
200LFM
Natconv
0 0.5 1 1.5 2.52 3
I -OutputCurrent- A
O
20
30
40
50
60
70
80
90
AmbientTemperature-
C°
100LFM
200LFM
AirFlow
V =12V
O
AirFlow
100LFM
200LFM
Natconv
0 0.5 1 1.5 2.52 3
I -OutputCurrent- A
O
20
30
40
50
60
70
80
90
AmbientTemperature-
C°
100LFM
200LFM
Natconv
AirFlow
V
O
=15V
AirFlow
100LFM
200LFM
Natconv
0 0.5 1 1.5 2
I -OutputCurrent- A
O
20
30
40
50
60
70
80
90
AmbientTemperature-
C°
100LFM
200LFM
Natconv
AirFlow
V
O
=22V
PTN78060W , PTN78060H
www.ti.com
................................................................................................................................................... SLTS229B – NOVEMBER 2004 – REVISED JUNE 2009
EFFICIENCY OUTPUT VOLTAGE RIPPLE POWER DISSIPATION
vs vs vs
OUTPUT CURRENT OUTPUT CURRENT OUTPUT CURRENT
Figure 19. Figure 20. Figure 21.
TEMPERATURE DERATING TEMPERATURE DERATING TEMPERATURE DERATING
vs vs vs
OUTPUT CURRENT OUTPUT CURRENT OUTPUT CURRENT
Figure 22. Figure 23. Figure 24.
TEMPERATURE DERATING TEMPERATURE DERATING
vs vs
OUTPUT CURRENT OUTPUT CURRENT
Figure 25. Figure 26.
(1) The electrical characteristic data has been developed from actual products tested at 25 ° C. This data is considered typical for the
converter. Applies to Figure 19 , Figure 20 , and Figure 21 .
(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer ' s maximum
operating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm, double-sided PCB with 2 oz. copper.
For surface mount packages, multiple vias (plated through holes) are required to add thermal paths around the power pins. Please refer
to the mechanical specification for more information. Applies to Figure 22 through Figure 26 .
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