Datasheet

TYPICAL CHARACTERISTICS (24-V INPUT)
(1) (2)
0 0.5 1 1.5 2 2.5 3
40
50
60
70
80
90
100
Efficiency-%
I -OutputCurrent- A
O
V =2.5V
O
V =3.3V
O
V =5V
O
V =15V
O
V =12V
O
0
20
120
40
140
60
160
80
180
100
200
0 0.5 1 1.5 2 2.5 3
I -OutputCurrent- A
O
V -OutputVoltageRipple-mV
O PP
V =12V
O
V =3.3V
O
V =5V
O
V =2.5V
O
V =15V
O
0
0.5
1
1.5
2
2.5
0 0.5 1 1.5 2 2.5 3
-PowerDissipation-W
P
D
I
O
-OutputCurrent- A
V
O
=5V
3
V
V
O
O
=12V
=15V
V
V
O
O
=2.5V
=3.3V
V
O
=3.3V
100LFM
Natconv
200LFM
AirFlow
20
30
40
50
60
70
80
90
AmbientTemperature- C°
0 0.5 1 1.5 2 2.5 3
I
O
-OutputCurrent- A
20
30
40
50
60
70
80
90
AmbientTemperature- C°
0 0.5 1 1.5 2 2.5 3
I
O
-OutputCurrent- A
V
O
=5V
AirFlow
200LFM
100LFM
Natconv
20
30
40
50
60
70
80
90
AmbientTemperature- C°
0 0.5 1 1.5 2 2.5 3
I
O
-OutputCurrent- A
AirFlow
200LFM
100LFM
Natconv
V
O
=12V
20
30
40
50
60
70
80
90
0 0.5 1 1.5 2 2.5 3
I
O
-OutputCurrent- A
AmbientTemperature- C°
AirFlow
V
O
=15V
100LFM
200LFM
Natconv
PTN78060W , PTN78060H
SLTS229B – NOVEMBER 2004 – REVISED JUNE 2009 ................................................................................................................................................... www.ti.com
EFFICIENCY OUTPUT VOLTAGE RIPPLE POWER DISSIPATION
vs vs vs
OUTPUT CURRENT OUTPUT CURRENT OUTPUT CURRENT
Figure 12. Figure 13. Figure 14.
TEMPERATURE DERATING TEMPERATURE DERATING TEMPERATURE DERATING
vs vs vs
OUTPUT CURRENT OUTPUT CURRENT OUTPUT CURRENT
Figure 15. Figure 16. Figure 17.
TEMPERATURE DERATING
vs
OUTPUT CURRENT
Figure 18.
(1) The electrical characteristic data has been developed from actual products tested at 25 ° C. This data is considered typical for the
converter. Applies to Figure 12 , Figure 13 , and Figure 14 .
(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer ' s maximum
operating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm, double-sided PCB with 2 oz. copper.
For surface mount packages, multiple vias (plated through holes) are required to add thermal paths around the power pins. Please refer
to the mechanical specification for more information. Applies to Figure 15 through Figure 18 .
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