Datasheet
TYPICAL CHARACTERISTICS (32-V INPUT)
(1) (2)
0
50
100
150
200
250
0 0.3 0.6 0.9 1.2 1.5
I -OutputCurrent- A
O
V
-OutputVoltageRipple-mV
O PP
V =22V
O
V =12V
O
V =5V
O
V =3.3V
O
V =9V
O
0
0.5
1
1.5
2
2.5
0 0.3 0.6 0.9 1.2 1.5
V
O
=12V
V
O
=5V
V
O
=3.3V
V
O
=15V
V =22V
O
I -OutputCurrent- A
O
P -PowerDissipation-W
D
20
30
40
50
60
70
80
90
100
0 0.3 0.6 0.9 1.2 1.5
Efficiency-%
I -OutputCurrent- A
O
V =3.3V
O
V =5V
O
V =12V
O
V =22V
O
V =15V
O
20
30
40
50
60
70
80
90
0 0.3 0.6 0.9 1.2 1.5
200LFM
60LFM
120LFM
V =3.3V
O
Natconv
I -OutputCurrent- A
O
TemperatureDerating- C°
20
30
40
50
60
70
80
90
0 0.3 0.6 0.9 1.2 1.5
200LFM
Natconv
I -OutputCurrent- A
O
TemperatureDerating- C°
120LFM
60LFM
V =5V
O
20
30
40
50
60
70
80
90
0 0.3 0.6 0.9 1.2 1.5
200LFM
Natconv
I -OutputCurrent- A
O
120LFM
60LFM
V =12V
O
TemperatureDerating- C°
20
30
40
50
60
70
80
90
0 0.2 0.60.4 0.8 1 1.2
I -OutputCurrent- A
O
T
emperatureDerating- C°
V =18V
O
200LFM
60LFM
120LFM
Natconv
20
30
40
50
60
70
80
90
0 0.3 0.6 0.9 1.2 1.5
200LFM
60LFM
120LFM
Natconv
V =15V
O
I -OutputCurrent- A
O
TemperatureDerating- C°
0 0.2 0.4 0.6 10.8
I -OutputCurrent- A
O
TemperatureDerating- C°
V =22V
O
Natconv
60LFM
120LFM
200LFM
20
30
40
50
60
70
80
90
PTN78000W , PTN78000H
www.ti.com
...................................................................................................................................... SLTS230C – NOVEMBER 2004 – REVISED SEPTEMBER 2008
EFFICIENCY OUTPUT VOLTAGE RIPPLE POWER DISSIPATION
vs vs vs
OUTPUT CURRENT OUTPUT CURRENT OUTPUT CURRENT
Figure 18. Figure 19. Figure 20.
TEMPERATURE DERATING TEMPERATURE DERATING TEMPERATURE DERATING
vs vs vs
OUTPUT CURRENT OUTPUT CURRENT OUTPUT CURRENT
Figure 21. Figure 22. Figure 23.
TEMPERATURE DERATING TEMPERATURE DERATING TEMPERATURE DERATING
vs vs vs
OUTPUT CURRENT OUTPUT CURRENT OUTPUT CURRENT
Figure 24. Figure 25. Figure 26.
(1) The electrical characteristic data has been developed from actual products tested at 25 ° C. This data is considered typical for the
converter. Applies to Figure 18 , Figure 19 , and Figure 20 .
(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer ' s maximum
operating temperatures. Derating limits apply to modules soldered directly to a 100-mm x 100-mm, double-sided PCB with 2 oz. copper.
For surface mount packages, multiple vias (plated through holes) are required to add thermal paths around the power pins. Please refer
to the mechanical specification for more information. Applies to Figure 21 through Figure 26 .
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