Datasheet

TYPICAL CHARACTERISTICS (24-V INPUT)
(1) (2)
50
60
70
80
90
100
0 0.3 0.6 0.9 1.2 1.5
Efficiency-%
I -OutputCurrent- A
O
V
O
=15V
V
O
=12V
V
O
=3.3V
V
O
=5V
V
O
=2.5V
0
20
40
60
80
100
120
140
0 0.3 0.6 0.9 1.2 1.5
I -OutputCurrent- A
O
V
-OutputVoltageRipple-mV
O
PP
V
O
=2.5V
V
O
=3.3V
V
O
=5V
V
O
=12V
V
O
=15V
0
0.5
1
1.5
2
0 0.3 0.6 0.9 1.2 1.5
P
-PowerDissip
ation-W
D
I -OutputCurrent- A
O
V
O
=12V
V
O
=9V
V
O
=5V
V
O
=3.3V
V
O
=2.5V
20
30
40
50
60
70
80
90
0 0.3 0.6 0.9 1.2 1.5
I
O
-OutputCurrent- A
60LFM
200LFM
120LFM
V =5V
O
Natconv
TemperatureDerating- C°
20
30
40
50
60
70
80
90
0 0.3 0.6 0.9 1.2 1.5
I
O
-OutputCurrent- A
200LFM
Natconv
60LFM
120LFM
V =3.3V
O
TemperatureDerating- C°
20
30
40
50
60
70
80
90
0 0.3 0.6 0.9 1.2 1.5
I
O
-OutputCurrent- A
60LFM
200LFM
120LFM
V =12V
O
Natconv
TemperatureDerating- C°
20
30
40
50
60
70
80
90
0 0.3 0.6 0.9 1.2 1.5
I -OutputCurrent- A
O
200LFM
Natconv
60LFM
120LFM
V =15V
O
TemperatureDerating- C°
20
40
50
60
70
80
90
0 0.2 0.4 0.6 0.8 1.21
I -OutputCurrent- A
O
TemperatureDerating- C°
30
V =18V
O
60LFM
Natconv
200LFM
120LFM
PTN78000W , PTN78000H
SLTS230C – NOVEMBER 2004 – REVISED SEPTEMBER 2008 ...................................................................................................................................... www.ti.com
EFFICIENCY OUTPUT VOLTAGE RIPPLE POWER DISSIPATION
vs vs vs
OUTPUT CURRENT OUTPUT CURRENT OUTPUT CURRENT
Figure 10. Figure 11. Figure 12.
TEMPERATURE DERATING TEMPERATURE DERATING TEMPERATURE DERATING
vs vs vs
OUTPUT CURRENT OUTPUT CURRENT OUTPUT CURRENT
Figure 13. Figure 14. Figure 15.
TEMPERATURE DERATING TEMPERATURE DERATING
vs vs
OUTPUT CURRENT OUTPUT CURRENT
Figure 16. Figure 17.
(1) The electrical characteristic data has been developed from actual products tested at 25 ° C. This data is considered typical for the
converter. Applies to Figure 10 , Figure 11 , and Figure 12 .
(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer ' s maximum
operating temperatures. Derating limits apply to modules soldered directly to a 100-mm x 100-mm, double-sided PCB with 2 oz. copper.
For surface mount packages, multiple vias (plated through holes) are required to add thermal paths around the power pins. Please refer
to the mechanical specification for more information. Applies to Figure 13 through Figure 17 .
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