Datasheet

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TYPICAL CHARACTERISTICS (7-V INPUT)
(1)(2)
0 0.3 0.6 0.9 1.51.2
I - Output Current - A
O
0
1
0.5
1.5
2
2.5
V = -5 V
O
V = -3 V
O
V = -12 V
O
V = -15 V
O
P - Power Dissipation - W
D
0 0.3 0.6 0.9 1.51.2
45
50
55
65
60
70
75
80
85
90
V = -5 V
O
V = -3 V
O
V = -12 V
O
V = -15 V
O
Efficiency - %
I - Output Current - A
O
0 0.3 0.6 0.9 1.51.2
I - Output Current - A
O
0
20
40
60
80
100
120
140
V = -5 V
O
V = -12 V
O
V = -15 V
O
V = -3 V
O
V - Output Voltage Ripple - mV
OPP
0 0.5 1 1.5
20
30
50
40
60
70
80
90
V = -5 V
O
200 LFM
100 LFM
Nat conv
Ambient Temperature - C
o
I - Output Current - A
O
0 0.25 0.5 0.75
20
30
50
40
60
70
80
90
Ambient Temperature - C
o
I - Output Current - A
O
V = -12 V
O
100 LFM
200 LFM
Nat conv
0 0.20.1 0.3 0.4 0.5 0.6
20
30
50
40
60
70
80
90
V = -15 V
O
200 LFM
100 LFM
Nat conv
Ambient Temperature - C
o
I - Output Current - A
O
PTN78000A
SLTS246BAPRIL 2005 REVISED JANUARY 2006
EFFICIENCY OUTPUT VOLTAGE RIPPLE POWER DISSIPATION
vs vs vs
OUTPUT CURRENT OUTPUT CURRENT OUTPUT CURRENT
Figure 1. Figure 2. Figure 3.
TEMPERATURE DERATING TEMPERATURE DERATING TEMPERATURE DERATING
vs vs vs
OUTPUT CURRENT OUTPUT CURRENT OUTPUT CURRENT
Figure 4. Figure 5. Figure 6.
(1) The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the
converter. Applies to Figure 1, Figure 2, and Figure 3.
(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum
operating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm, double-sided PCB with 2 oz. copper.
For surface mount packages, multiple vias (plated through holes) are required to add thermal paths to the power pins. Please refer to
the mechanical specification for more information. Applies toFigure 4 ,Figure 5 , and Figure 6.
5