Datasheet
PTN04050C
SLTS251A –SEPTEMBER 2005–REVISED FEBRUARY 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see
the TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range unless otherwise noted
all voltages with respect to GND (pin 1),
UNIT
T
A
Operating free-air temperature Over V
I
range –40°C to 85°C
Leaded temperature (H suffix) 5 seconds 260°C
(2)
Solder reflow temperature (S suffix) Surface temperature of module body or pins 235°C
Solder reflow temperature (Z suffix)
(3)
Surface temperature of module body or pins 260°C
(3)
T
stg
Storage temperature –55°C to 125°C
P
O
Output power 12 W
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) This model is NOT compatible with surface-mount reflow solder process.
(3) Moisture Sensitivity Level (MSL) Rating Level-3-260C-168HR
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
V
I
Input voltage 2.95 5.5 V
T
A
Operating free-air temperature –40 85 °C
PACKAGE SPECIFICATIONS
PTN04050Cx (Suffix AH, AS, and AZ)
Weight 2.8 grams
Flammability Meets UL 94 V-O
Per Mil-STD-883D, Method 2002.3, 1 ms, 1/2 sine,
Mechanical shock 500 G
(1)
mounted
Horizontal T/H (suffix AH) 20 G
(1)
Mechanical vibration Mil-STD-883D, Method 2007.2, 20-2000 Hz
Horizontal SMD (suffix AS and AZ) 15 G
(1)
(1) Qualification limit.
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