Datasheet
MarginDown
MarginUp
V
I
C
560 F
(Required)
I
m
C 1
330 F
(Optional)
O
m
C 2
Ceramic
(Optional)
O
+
+
Inhibit
GND GND
V
O
V Sense
O
Track
1
2
10
7
6
54
3
9 8
R ,1%
(Required)
SET
L
O
A
D
ABSOLUTE MAXIMUM RATINGS
PTH12060W/L
SLTS217H – MAY 2003 – REVISED DECEMBER 2008 ....................................................................................................................................................
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
STANDARD APPLICATION
A. R
SET
= Required to set the output voltage to a value higher than the minimum value. See the Application Information
section for values.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see
the TI website at www.ti.com.
voltages are with respect to GND
UNIT
V
I
Input voltage Track – 0.3 V to V
I
+0.3 V
Operating temperature – 40 ° C to 85 ° C
(1)
T
A
Over V
I
range
range
PTH12060WAH 260 ° C
(2)
Wave solder
T
wave
Surface temperature of module body or pins (5 seconds)
temperature
PTH12060WAD
PTH12060WAS 235 ° C
(2)
Solder reflow
T
reflow
Surface temperature of module body or pins
temperature
PTH12060WAZ 260 ° C
(2)
T
stg
Storage temperature – 55 ° C to 125 ° C
(3)
Mechanical shock Per Mil-STD-883D, Method 2002.3, 1 msec, Sine, mounted 500 G
Mechanical vibration Mil-STD-883D, Method 2007.2, 20-2000 Hz 20 G
Weight 5 grams
Flammability Meets UL 94V-O
(1) For operation below 0 ° C, the external capacitors must have stable characteristics. Use either a low ESR tantalum, Os-Con, or ceramic
capacitor.
(2) During soldering of package version, do not elevate peak temperature of the module, pins or internal components above the stated
maximum.
(3) The shipping tray or tape & reel cannot be used to bake parts at temperatures higher than 65 ° C.
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