Datasheet
PTH12020W TYPICAL CHARACTERISTICS (V
I
= 12 V)
(1) (2)
50
60
70
80
90
100
0 3 6 9 12 15 18
Output Ripple − mV
I
O
− Load Current − A
V
O
= 5 V
V
O
= 3.3 V
V
O
= 2.5 V
V
O
= 1.8 V
V
O
= 1.5 V
V
O
= 1.2 V
V
O
= 2 V
(See Note A)
50
60
70
80
90
100
0 3 6 9 12 15 18
V
O
= 5 V
V
O
= 3.3 V
V
O
= 2.5 V
V
O
= 2 V
V
O
= 1.8 V
V
O
= 1.5 V
V
O
= 1.2 V
Efficiency − %
I
O
− Load Current − A
(See Note A)
0
1
2
3
4
5
6
0 5 10 15
I
O
− Load Current − A
V
O
= 5 V
V
O
= 3.3 V
V
O
= 2.5 V
V
O
= 1.8 V
V
O
= 1.5 V
V
O
= 1.2 V
V
O
= 2 V
− Power Dissipation − W
P
D
15
(See Note A)
20
30
40
50
60
70
80
90
0 3 6 9 12 15 18
400 LFM
200 LFM
100 LFM
Nat Conv
V
O
= 2.5 V
T
A
− Ambient Temperature −
5
C
I
O
− Load Current − A
(See Note B)
20
30
40
50
60
70
80
90
0 3 6 999 12 15 18
400 LFM
200 LFM
100 LFM
Nat Conv
V
O
= 5 V
T
A
− Ambient Temperature −
5
C
I
O
− Load Current − A
(See Note B)
20
30
40
50
60
70
80
90
0 3 6
400 LFM
200 LFM
100 LFM
Nat Conv
V
O
= 1.8 V
T
A
− Ambient Temperature −
5
C
I
O
− Load Current − A
9 12 15 18
(See Note B)
PTH12020W/L
www.ti.com
............................................................................................................................................................. SLTS208I – MAY 2003 – REVISED MARCH 2009
EFFICIENCY OUTPUT RIPPLE POWER DISSIPATION
vs vs vs
LOAD CURRENT LOAD CURRENT LOAD CURRENT
Figure 1. Figure 2. Figure 3.
TEMPERATURE DERATING TEMPERATURE DERATING TEMPERATURE DERATING
vs vs vs
OUTPUT CURRENT OUTPUT CURRENT OUTPUT CURRENT
Figure 4. Figure 5. Figure 6.
(1) Note A: The electrical characteristic data has been developed from actual products tested at 25 ° C. This data is considered typical for the
converter. Applies to Figure 1 , Figure 2 , and Figure 3 .
(2) Note B: The temperature derating curves represent the conditions at which internal components are at or below the manufacturer ' s
maximum operating temperatures. Derating limits apply to modules soldered directly to a 4 inch × 4 inch double-sided PCB with 1oz.
copper. For surface mount products (AS and AZ suffix), multiple vias (plated through holes) are required to add thermal paths around
the power pins. Please refer to the mechanical specification for more information. Applies to Figure 4 , Figure 5 and Figure 6 .
Copyright © 2003 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s) :PTH12020W/L