Datasheet

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PTH12010x
(Top View)
1
2
10
7
6
54
3
MarginUp
MarginDown
V
I
L
O
A
D
C
560 F
(Required)
I
m
R ,1%
(Required)
SET
+
C
330 F
(Optional)
O
m
+
Inhibit
GND
GND
V
O
V
O
Sense
Track
9 8
ABSOLUTE MAXIMUM RATINGS
PTH12010W , PTH12010L
SLTS205G – JUNE 2003 – REVISED FEBRUARY 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
STANDARD APPLICATION
A. R
SET
= Required to set the output voltage to a value higher than the lowest value (see the electrical characteristics
table for values).
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see
the TI website at www.ti.com.
Voltages are with respect to GND
MIN TYP MAX UNIT
V
track
Track Input Voltage –0.3 V
I
+ 0.3 V
T
A
Operating Temperature Over V
I
Range –40
(1)
85 ° C
Range
T
wave
Wave solder Surface temperature of module body or pins PTH12010WAH 260
(2)
temperature (5 seconds)
° C
PTH12010WAS 235
(2)
Solder reflow
T
reflow
Surface temperature of module body or pins
temperature
PTH12010WAZ 260
(2)
T
stg
Storage Temperature –55 125
(3)
° C
Mechanical Shock Per Mil-STD-883D, Method 2002.3, 1 msec, 1/2 Sine, mounted 500 G
Mechanical Vibration Mil-STD-883D, Method 2007.2 20 G
20-2000 Hz
Weight 5 grams
Flammability Meets UL 94V-O
(1) For operation below 0 ° C the external capacitors must have stable characteristics. Use either a low-ESR tantalum, Os-Con, or ceramic
capacitor.
(2) During soldering of package version, do not elevate peak temperature of the module, pins or internal components above the stated
maximum.
(3) The shipping tray or tape and reel cannot be used to bake parts at temperatures higher than 65°C.
2
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