Datasheet
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ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
PACKAGE SPECIFICATIONS
PTH04070W
SLTS227B – SEPTEMBER 2004 – REVISED OCTOBER 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see
the TI website at www.ti.com.
over operating free-air temperature range unless otherwise noted
(1)
PTH04070 UNIT
T
A
Operating free-air Over V
I
range -40 to 85
temperature
T
wave
Wave solder Surface temperature of module body or pins Suffix AH & AD 260
temperature (5 seconds maximum)
° C
T
reflow
Solder reflow Surface temperature of module body or pins Suffix AS 235
(2)
temperature
Suffix AZ 260
(2)
T
stg
Storage temperature -55 to 125
(3)
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) During reflow of surface mount package version do not elevate peak temperature of the module, pins or internal components above the
stated maximum.
(3) The shipping tray or tape and reel cannot be used to bake parts at temperatures higher than 65 ° C.
MIN MAX UNIT
V
I
Input voltage 3 5.5 V
T
A
Operating free-air temperature – 40 85 ° C
PTH04070WXX
Weight 1.5 grams
Flammability Meets UL 94 V-O
Per Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine,
Mechanical shock 500 G
(1)
mounted
Mechanical vibration Mil-STD-883D, Method 2007.2, 20-2000 Hz 20 G
(1)
(1) Qualification limit.
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Product Folder Link(s): PTH04070W