Datasheet
PTH04040W
19 20 18
Margin
Down
Track
Margin
Up
12
15
9
14
11
+ +
+
1 3 5 10 13 16 17
UVLO
4
6
2
8
Inhibit GND GND VoAdj
−Sense
Vo
+Sense
UDG−05085
A
B
C
C
V
O
C
O
1
330 µF
C
O
2
330 µF
R
SET
1%
0.05 W
C
I
1000 µF
(Required)
V
I
V
I
7
PTH04040W
SLTS238C –SEPTEMBER 2005–REVISED JUNE 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
STANDARD APPLICATION
A. For C
I
, a minimum of 1,000 mF (or 2 × 470 mF) of input capacitance is required for proper operation.
B. R
SET
is required to set the desired output voltage from the module higher than the minimum value.
C. For C
O
1 and C
O
2, a minimum of 660 mF (or 2 × 330 mF) of output capacitance is required for load transient
regulation.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see
the TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
UNIT
Signal input voltages Track control (pin 18) –0.3 V to V
I
+ 0.3 V
T
A
Operating temperature range over V
I
range –40°C to 85°C
Wave solder Surface temperature of module body or pins PTH04040WAH
T
wave
260°C
(1)
temperature (5 seconds) PTH04040WAD
PTH04040WAS 235°C
(1)
Solder reflow
T
reflow
Surface temperature of module body or pins
temperature
PTH04040WAZ 260°C
(1)
T
S
Storage temperature –55°C to 125°C
Mechanical shock Per Mil-STD-883D, Method 2002.3, 1 msec, ½ Sine, mounted 500 G
(2)
Mechanical vibration Mil-STD-883D, Method 2007.2, 20–2000 Hz 10 G
(2)
Weight 22.5 grams
Flammability Meets UL94V-O
(1) During soldering of package version, do not elevate peak temperature of the module, pins or internal components above the stated
maximum.
(2) Qualification limits
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