Datasheet
PGA870
SBOS436A –DECEMBER 2009–REVISED FEBRUARY 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT MEDIA,
PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER QUANTITY
PGA870 PGA870IRHDT Tape and Reel, 250
PGA870 QFN-28 RHD –40°C to +85°C
PGA870 PGA870IRHDR Tape and Reel, 3000
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
PGA870 UNIT
Power supply 6 V
Internal power dissipation See Thermal Characteristics
Input voltage range V
S
V
Storage temperature range –65 to +150 °C
Maximum junction temperature (T
J
) +150 °C
Maximum junction temperature (T
J
), continuous operation, long-term reliability +140 °C
Human body model (HBM) 2000 V
ESD rating Charged device model (CDM) 1000 V
Machine model (MM) 200 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
DISSIPATION RATINGS
(1)
POWER RATING
(2)
(T
J
= +125°C)
PACKAGE θ
JP
(°C/W) θ
JA
(°C/W) T
A
= +25°C T
A
= +85°C
QFN-28 4.1 35 2.9 W 0.87 W
(1) These data were taken with the JEDEC High-K test PCB. For the JEDEC low-K test PCB, θ
JA
is 350°C/W.
(2) Power rating is determined with a junction temperature of +125°C. This is the point where distortion starts to substantially increase and
long-term reliability starts to be reduced. Thermal management of the final printed circuit board should strive to keep the junction
temperature at or below +125° C for best performance and reliability.
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