Datasheet

PGA309
SBOS292C –DECEMBER 2003–REVISED JANUARY 2011 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
PACKAGE PACKAGE
PRODUCT PACKAGE-LEAD DESIGNATOR MARKING
PGA309 TSSOP-16 PW PGA309
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
PARAMETER PGA309 UNIT
Supply Voltage, V
SD
, V
SD
+7.0 V
Input Voltage, V
IN1
, V
IN2
(2)
–0.3 to V
SA
+0.3 V
Input Current, V
FB
, V
OUT
±150 mA
Input Current ±10 mA
Output Current Limit 50 mA
Storage Temperature Range –60 to +150 °C
Operating Temperature Range –55 to +150 °C
Junction Temperature +150 °C
ESD Ratings Human Body Model (HBM) 4 kV
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should
be current limited to 10mA or less.
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