Datasheet

PGA308
SBOS440B JULY 2008REVISED DECEMBER 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
PACKAGE PACKAGE
PRODUCT PACKAGE-LEAD DESIGNATOR MARKING
MSOP-10 DGS P30A
PGA308
3mm × 4mm DFN-10 DRK P30B
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
PARAMETER PGA308 UNIT
Supply Voltage, V
S
+5.5 V
D
OUT
/V
CLAMP
Output Current Limit ±10 mA
Input Current –10 to +10 mA
V
IN1
, V
IN2
, V
REF
, 1W, D
OUT
/V
CLAMP
, V
SJ
(2)
GND – 0.3 to V
S
+ 0.3 V
Pin Protection V
FB
Terminal Voltage –30 to 30 V
V
FB
Terminal Current –10 to 10 mA
V
OUT
–160 to 160 mA
Operating Temperature Range –40 to +150 °C
Storage Temperature Range –55 to +150 °C
Junction Temperature +165 °C
ESD Ratings Human Body Model (HBM) 2000 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) Terminals are diode-clamped to the power-supply rails, V
S
and GND. Limit current to 10mA or less.
2 Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated
Product Folder Link(s): PGA308