Datasheet

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SBOS207B − OCTOBER 2001 − REVISED JUNE 2004
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2
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
PGA2310 UNIT
V
A
+ +16.0 V
Supply voltage
V
A
− −16.0 V
Supply voltage
V
D
+ +6.5 V
Analog input voltage 0 to V
A
+, V
A
− V
Digital input voltage −0.3 to V
D
+ V
Operating temperature range −55 to +125 °C
Storage temperature range −65 to +150 °C
Junction temperature +150 °C
Lead temperature (soldering, 10s) +300 °C
Package temperature (IR, reflow, 10s) +235 °C
(1)
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or
any other conditions beyond those specified is not implied.
ORDERING INFORMATION
(1)
PRODUCT PACKAGE−LEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
DIP-16 N PGA2310PA PGA2310PA Rails, 25
PGA2310
SOL-16
DW
−40°C to +85°C
PGA2310UA PGA2310UA Rails, 48
PGA2310
SOL-16
DW
−40 C to +85 C
PGA2310UA PGA2310UA/1K Tape and Reel, 1000
(1)
For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.