Datasheet

5
®
PGA204/205
DICE INFORMATION
PAD FUNCTION
1V
O1
2—
3—
4V
–
IN
5V
+
IN
6V
OS
Adj
7V
OS
Adj
8V–
FPO
MECHANICAL INFORMATION
MILS (0.001") MILLIMETERS
Die Size 186 x 130 ±5 4.72 x 3.30 ±0.13
Die Thickness 20 ±3 0.51 ±0.08
Min. Pad Size 4 x 4 0.1 x 0.1
Backing Gold
Substrate Bias: Internally connected to V– power supply.
PGA204/205 DIE TOPOGRAPHY
PIN CONFIGURATION
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with ap-
propriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
NC: No Internal Connection.
V
O1

NC
NC
V
–
IN
V
+
IN
V
OS
Adjust
V
OS
Adjust
V–
A
1

A
0
Dig. Ground
V+
Feedback
V
O

Ref
V
O2
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
Top View
PAD FUNCTION
9V
O2
10 Ref
11 V
O
12 Feedback
13 V+
14 Dig. Ground
15 A
0
16 A
1