Datasheet

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SBAS327A − JUNE 2004 − REVISED SEPTEMBER 2004
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PowerPAD THERMALLY ENHANCED PACKAGING
The PowerPAD concept is implemented in standard epoxy
resin package material. The integrated circuit is attached
to the leadframe die pad using thermally conductive epoxy.
The package is molded so that the leadframe die pad is
exposed at a surface of the package. This provides an
extremely low thermal resistance to the path between the
IC junction and the exterior case. The external surface of
the leadframe die pad is located on the PCB side of the
package, allowing the die pad to be attached to the PCB
using standard flow soldering techniques. This allows
efficient attachment to the PCB and permits the board
structure to be utilized as a heat sink for the package.
Using a thermal pad identical in size to the die pad and vias
connected to the PCB ground plane, the board designer
can now implement power packaging without additional
thermal hardware (for example, external heat sinks) or the
need for specialized assembly instructions.
Figure 18 illustrates a cross-section view of a PowerPAD
package.
IC Die
Wire Bond Wire Bond
Leadframe Die Pad
Exposed at Base of Package
Die Attach Epoxy
(thermally conductive)
Leadframe
Mold Compount
(Epoxy)
Figure 18. Cross-Section View of a PowerPAD Thermally-Enhanced Package