Datasheet

PCM2900C
PCM2902C
SBFS039 –SEPTEMBER 2011 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGING/ORDERING INFORMATION
(1)
SPECIFIED TRANSPORT
PACKAGE TEMPERATURE PACKAGE ORDERING MEDIA,
PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER QUANTITY
PCM2900CDB Rails, 47
PCM2900CDB SSOP-28 DB –25°C to +85°C PCM2900C
Tape and Reel,
PCM2900CDBR
2000
PCM2902CDB Rails, 47
PCM2902CDB SSOP-28 DB –25°C to +85°C PCM2902C
Tape and Reel,
PCM2902CDBR
2000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted).
PARAMETER PCM2900C/PCM2902C UNIT
V
BUS
Supply voltage –0.3 to 6.5 V
Ground voltage differences, AGNDC, AGNDP, AGNDX, DGND, DGNDU ±0.1 V
SEL0, SEL1, TEST0 (DIN)
(2)
–0.3 to 6.5 V
Digital input voltage
D+, D–, HID0, HID1, HID2, XTI, XTO, TEST1 (DOUT)
(2)
, SSPND –0.3 to (V
DDI
+ 0.3) < 4 V
V
IN
L, V
IN
R, V
COM
, V
OUT
R, V
OUT
L –0.3 to (V
CCCI
+ 0.3) < 4 V
Analog input
voltage
V
CCCI
, V
CCP1I
, V
CCP2I
, V
CCXI
, V
DDI
–0.3 to 4 V
Input current (any pins except supplies) ±10 mA
Ambient temperature under bias –40 to +125 °C
T
stg
Storage temperature –55 to +150 °C
T
J
Junction temperature +150 °C
Package temperature (IR reflow, peak) +250 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) TEST0 and TEST1 apply to the PCM2900C; DIN and DOUT apply to the PCM2902C.
THERMAL INFORMATION
PCM2900C PCM2902C
THERMAL METRIC
(1)
DB DB UNITS
28 PINS 28 PINS
θ
JA
Junction-to-ambient thermal resistance 64.5 64.5
θ
JCtop
Junction-to-case (top) thermal resistance 24.5 24.5
θ
JB
Junction-to-board thermal resistance 25.4 25.4
°C/W
ψ
JT
Junction-to-top characterization parameter 2.0 2.0
ψ
JB
Junction-to-board characterization parameter 25.0 25.0
θ
JCbot
Junction-to-case (bottom) thermal resistance N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Product Folder Link(s): PCM2900C PCM2902C