Datasheet

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ABSOLUTE MAXIMUM RATINGS
PCM2901
PCM2903
SLES034C MARCH 2002 REVISED NOVEMBER 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
PCM2901
SPECIFIED
PACKAGE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD TEMPERATURE
DESIGNATOR MARKING NUMBER
(1)
MEDIA
RANGE
PCM2901E Rails
PCM2901E SSOP-28 28DB 25 ° C to 85 ° C PCM2901E
PCM2903E/2K Tape and reel
(1) Models with a slash (/) are available only in tape and reel in the quantities indicated (e.g., /2K indicates 2000 devices per reel). Ordering
2000 pieces of PCM2901E/2K gets a single 2000-piece tape and reel.
PCM2903
SPECIFIED
PACKAGE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD TEMPERATURE
DESIGNATOR MARKING NUMBER
(1)
MEDIA
RANGE
PCM2903E Rails
PCM2903E SSOP-28 28DB 25 ° C to 85 ° C PCM2903E
PCM2903E/2K Tape and reel
(1) Models with a slash (/) are available only in tape and reel in the quantities indicated (e.g., /2K indicates 2000 devices per reel). Ordering
2000 pieces of PCM2903E/2K gets a single 2000-piece tape and reel.
over operating free-air temperature range (unless otherwise noted)
(1)
PCM2901/PCM2903 UNIT
Supply voltage, V
CCC
, V
CCP1
, V
CCP2
, V
CCX
, V
DD
0.3 to 4 V
Supply voltage differences, V
CCC
, V
CCP1
, V
CCP2
, V
CCX
, V
DD
± 0.1 V
Ground voltage differences, AGNDC, AGNDP, AGNDX, DGND, DGNDU ± 0.1 V
SEL0, SEL1, TEST0 (DIN)
(2)
0.3 to 6.5 V
Digital input voltage
D+, D , HID0, HID1, HID2, XTI, XTO, TEST1 (DOUT)
(2)
, SSPND 0.3 to (V
DD
+ 0.3) < 4 V
Analog input voltage V
IN
L, V
IN
R, V
COM
, V
OUT
R, V
OUT
L 0.3 to (V
CCC
+ 0.3) < 4 V
Input current (any pins except supplies) ± 10 mA
Ambient temperature under bias 40 to 125 ° C
Storage temperature, T
stg
55 to 150 ° C
Junction temperature T
J
150 ° C
Lead temperature (soldering) 260 ° C, 5 s
Package temperature (IR reflow, peak) 250 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) ( ): PCM2903
2 Submit Documentation Feedback Copyright © 2002 2007, Texas Instruments Incorporated
Product Folder Link(s): PCM2901 PCM2903