Datasheet

Physical Considerations
2-5
Evaluation Module Layout
2.4 Area 300—Quad Device TSSOP PowerPAD
Area 300 uses 3xx reference designators, and is compatible with quad op
amps, with or without shutdown, packaged in a 16-pin TSSOP PowerPAD.
This surface-mount package is designated by a PW (non-PowerPAD) or a
PWP (PowerPAD) suffix in TI part numbers, as in TxxxxIPWP. When using a
PowerPAD device, the PowerPAD on the bottom of the package must be
soldered to the PCB. If the appropriate equipment for soldering the PowerPAD
to the PCB is not available, thermal grease can be used to improve the heat
transfer into the PCB.
When using the non-shutdown version of the device, ensure that the IC is
aligned at the top of the IC pad array—the last two PCB pads will be unused.
Figure 2–3 shows the area 300 schematic.