Datasheet

Physical Considerations
2-4
Evaluation Module Layout
2.3 Area 200—Dual Device MSOP PowerPAD
Area 200 uses 2xx reference designators, and is compatible with dual op
amps, with shutdown, packaged as a 10-pin MSOP PowerPAD. This package
is designated by a DGS (non-PowerPAD), and DGQ (PowerPAD) suffix in TI
part numbers, as in TxxxxCDGQ. When using a PowerPAD device, the
PowerPAD on the bottom of the package must be soldered to the PCB. If the
appropriate equipment for soldering the PowerPAD to the PCB is not available,
thermal grease can be used to improve the heat transfer into the PCB.
Figure 2–2 shows the area 200 schematic.
Figure 2–2. Area 200 Schematic—Dual Device, MSOP PowerPAD (10 pin)
B2/SD
C206 C207
C209 C210
V2+
V2–
V2+
GND2
V2–
Power Supply Bypass
+
–
10
1
4
3
2
V2+
V2–
R212
C215
R216
C211
R221
R220
R218
R219
R217
R215
C212
C213
A2OUT
1/2 Dual Op Amp
A201–
A202–
A203+
A204+
+
–
R206
C202
R207
C203
R204
R203
R205
R201
R202
R209
C204
C201
B2OUT
1/2 Dual Op Amp
B201–
B202–
B203+
B204+
U201a
U201b
9
7
8
C214
R214
A2 FLT
C205
R208
B2 FLT
A2/SD
5
6
R211
U202
R213
Voltage Reference
V2+ VREF2
R210
C208