Universal Operational Amplifier Single, Dual, Quad (MSOP/TSSOP) Evaluation Module With Shutdown User’s Guide October 1999 Mixed-Signal Products SLOU055
IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete.
Preface Related Documentation From Texas Instruments J J J Amplifiers, Comparators, and Special Functions Data Book (literature number SLYD011 and SLYD012). This data book contains data sheets and other information on the TI operational amplifiers that can be used with this evaluation module. Operational Amplifier Supplement Data Book (literature number SLOD002). This data book contains data sheets and other information on the TI operational amplifiers that can be used with this evaluation module.
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Running Title—Attribute Reference Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1 Design Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 1.2 Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Running Title—Attribute Reference Figures 2–1 2–2 2–3 2–4 2–5 2–6 2–7 2–8 2–9 Area 100 Schematic—Single Device, MSOP (8-pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Area 200 Schematic—Dual Device, MSOP PowerPAD (10-pin) . . . . . . . . . . . . . . . . . . . . . 2-4 Area 300 Schematic—Quad Device, TSSOP PowerPAD (16-pin) . . . . . . . . . . . . . . . . . . . . 2-6 Views of Thermally Enhanced DGN Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 1 Introduction This user’s guide describes the universal operational amplifier single, dual, quad (MSOP/ TSSOP) evaluation module (EVM) with shutdown (SLOP247). The EVM simplifies evaluation of Texas Instruments surface-mount op amps with or without shutdown feature. Topic Page 1.1 Design Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Design Features 1.1 Design Features The EVM board design allows many circuits to be constructed easily and quickly. There are three circuit development areas on the board. Area 100 is for a single operational amplifier (op amp), with or without shutdown. It also features offset nulling pin pads and can use the MSOP PowerPAD package. Area 200 is for a dual op amp, with shutdown. Like area 100, it uses the MSOP PowerPAD package.
Chapter 2 Evaluation Module Layout This chapter shows the universal operational amplifier single, dual, quad (MSOP/TSSOP) evaluation module (EVM) with shutdown board layout, schematics of each area, and describes the relationships between the three areas. Topic Page 2.1 Physical Consideration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2 2.2 Area 100 — Single Device MSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–3 2.
Physical Considerations 2.1 Physical Considerations The EVM board has three circuit development areas. Each area can be separated from the others by breaking along the score lines. The circuit layout in each area supports an op amp package, voltage reference, and ancillary devices. The op amp package is unique to each area as described in the following paragraphs. The voltage reference and supporting devices are the same for all areas.
Physical Considerations 2.2 Area 100—Single Device MSOP Area 100 uses 1xx reference designators, and is compatible with a single op amp, with or without shutdown, packaged as an 8-pin MSOP, with or without PowerPAD. This surface-mount package is designated by a DGK (non-PowerPAD) and DGN (PowerPAD) suffix in TI part numbers, as in TxxxxCDGK, TxxxxIDGN, etc. Offset nulling can be extremely important in some applications. The EVM accommodates TI IC op amps that provide this feature.
Physical Considerations 2.3 Area 200—Dual Device MSOP PowerPAD Area 200 uses 2xx reference designators, and is compatible with dual op amps, with shutdown, packaged as a 10-pin MSOP PowerPAD. This package is designated by a DGS (non-PowerPAD), and DGQ (PowerPAD) suffix in TI part numbers, as in TxxxxCDGQ. When using a PowerPAD device, the PowerPAD on the bottom of the package must be soldered to the PCB.
Physical Considerations 2.4 Area 300—Quad Device TSSOP PowerPAD Area 300 uses 3xx reference designators, and is compatible with quad op amps, with or without shutdown, packaged in a 16-pin TSSOP PowerPAD. This surface-mount package is designated by a PW (non-PowerPAD) or a PWP (PowerPAD) suffix in TI part numbers, as in TxxxxIPWP. When using a PowerPAD device, the PowerPAD on the bottom of the package must be soldered to the PCB.
Physical Considerations Figure 2–3.
General PowerPAD Design Considerations 2.5 General PowerPAD Design Considerations The Texas Instruments thermally-enhanced DGN, DGQ, and PWP packages, which are members of the PowerPAD family of packages. This package is constructed using a downset leadframe upon which the die is mounted [see Figure 2–4(a) and Figure 2–4(b)]. This arrangement results in the lead frame being exposed as a thermal pad on the underside of the package [see Figure 2–4(c)].
General PowerPAD Design Considerations 4) Connect all holes to the internal ground plane. 5) When connecting these holes to the ground plane, do not use the typical web or spoke via connection methodology. Web connections have a high thermal resistance connection that is useful for slowing the heat transfer during soldering operations. This makes the soldering of vias that have plane connections easier. In this application, however, low thermal resistance is desired for the most efficient heat transfer.
General Power Dissipation Considerations 2.6 General Power Dissipation Considerations For a given θJA, the maximum power dissipation is shown in Figure 2–6 and is calculated by the following formula: P + D Where: ǒ Ǔ T –T MAX A q JA PD = Maximum power dissipation of Txxxx IC (watts) TMAX = Absolute maximum junction temperature (150°C) TA = Free-air temperature (°C) θJA = θJC + θCA θJC = Thermal coefficient from junction to case θCA = Thermal coefficient from case to ambient air (°C/W) Figure 2–6.
EVM Component Placement 2.7 EVM Component Placement Figure 2–7 shows component placement for the EVM board. Figure 2–7.
EVM Board Layout 2.8 EVM Board Layout Figures 2–8 and 2–9 show the EVM top and bottom board layouts, respectively. Figure 2–8.
EVM Board Layout Figure 2–9.
Chapter 3 Example Circuits This chapter shows and discusses several example circuits that can be constructed using the universal operational amplifier EVM. The circuits are all classic designs that can be found in most operational amplifier design books. Topic Page 3.1 Schematic Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2 3.2 Inverting Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2 3.
Schematic Conventions 3.1 Schematic Conventions Figures 3–1 through 3–6 show schematic examples of circuits that can be constructed using the universal operational amplifier EVM with shutdown. The components that are placed on the board are shown in bold. Unused components are blanked out. Jumpers and other changes are noted. These examples are only a few of the many circuits that can be built. 3.
Noninverting Amplifier 3.3 Noninverting Amplifier Figure 3–2 shows area 100 equipped with a single operational amplifier configured as a noninverting amplifier with single-supply power input. Basic setup is done by choice of input and feedback resistors. The transfer function for the circuit as shown is: V OUT ǒ Ǔ + VIN 1 ) R112 ) VREF1 R109 The input signal must be referenced to VREF1.
Differential Amplifier 3.4 Differential Amplifier Figure 3–3 shows area 100 equipped with a single operational amplifier configured as a differential amplifier using a voltage reference and single power supply. Basic setup is done by choice of input and feedback resistors.
Sallen-Key Low-Pass Filter 3.5 Sallen-Key Low-Pass Filter Figure 3–4 shows area 200 equipped with a dual operational amplifier configured as a second-order Sallen-Key low-pass filter using dual-power supplies. Basic setup is done by proper choice of resistors R and mR and capacitors C and nC. The transfer function is: V OUT V IN + 1 Where: ǒ Ǔ ) ǒ Ǔǒ Ǔ 1 * 2 j Q f fo fo + 2p Ǹm1 n RC Q + mǸm) n1 And f fo Figure 3–4.
Sallen-Key High-Pass Filter 3.6 Sallen-Key High-Pass Filter Figure 3–5 shows area 200 equipped with a dual operational amplifier configured as a second-order Sallen-Key high-pass filter using single-supply power input. Basic setup is done by proper choice of resistors R and mR and capacitors C and nC. Note that capacitors should be used for components R201 and R205, and a resistor for C201.
Sallen-Key High-Pass Filter Figure 3–5. Sallen-Key High-Pass Filter With Single Supply Using Area 200 R216 C211 V2+ R212 R221 Jumper C206 0.1 µF C207 10 µF R220 A202– R219 R218 A203+ C209 C210 R217 A204+ Power Supply Bypass V2– Jumper V2– Jumper V2+ 5 2 10 – 1 3 + U201A 4 A201– V2+ GND2 C215 V2– C212 A2/SD A2OUT 1/2 Dual Op Amp Not Used R215 R214 A2 FLT C213 C214 R207 R206 VREF2 = 2.5 V R204 C202 R203 R210 Jumper 2.
Two Operational Amplifier Instrumentation Amplifier 3.7 Two Operational Amplifier Instrumentation Amplifier Figure 3–6 shows area 200 equipped with a dual operational amplifier configured as a two-operational-amplifier instrumentation amplifier using a voltage reference and single power supply. Basic setup is done by choice of input and feedback resistors.
Two Operational Amplifier Instrumentation Amplifier Figure 3–6. Two Operational Amplifier Instrumentation Amplifier With Single Supply Using Area 200 C211 R216 Jumper A201 – to B2OUT R212 R221 R217 = R212 II R220 or Short if Using Low Input Bias Op Amp C215 Jumper R220 A202– V2+ R219 R218 A203+ V2– 3 + A204+ Jumper GND2 V2+ 10 2 – R217 V2+ C206 0.
Quad Operational Amplifier Instrumentation Amplifier 3.8 Quad Operational Amplifier Instrumentation Amplifier Figure 3–7 shows area 300 equipped with a quad operational amplifier configured as a quad-operational-amplifier instrumentation amplifier using a dual power supply. Basic setup is done by choice of input and feedback resistors.
Quad Operational Amplifier Instrumentation Amplifier Figure 3–7. Quad Operational Amplifier Instrumentation Amplifier With Dual Supply Using Area 300 R304 C302 V3+ 2.5 = V3+ R302 R301 C301 A301– V3+ 4 2 – 8 3 + R303 100 Ω A302– Jumpers A303+ R306 10 µF 5 kΩ A304+ C314 GND3 1 0.1 µF 10 µF AB3/SD A3 OUT C311 C312 2.5 = V3– U301A 13 R305 0.
3-12 Example Circuits
