Datasheet

1
2
3
4
8
7
6
5
I
Q
Adjust
E
B
V
−
=
−
5V
C
V+ = +5V
NC
NC
SO−8
Top View
1
2
3
6
5
4
I
Q
Adjust
−
V
S
B
+V
S
C
E
SOT23−6
OPA861
SBOS338G –AUGUST 2005–REVISED MAY 2013 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT MEDIA,
PRODUCT PACKAGE DESIGNATOR RANGE MARKING NUMBER QUANTITY
OPA861ID Rails, 75
OPA861 SO-8 D –45°C to +85°C OPA861
OPA861IDR Tape and Reel, 2500
OPA861IDBVT Tape and Reel, 250
OPA861 SOT23-6 DBV –45°C to +85°C N5R
OPA861IDBVR Tape and Reel, 3000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Power Supply ±6.5V
DC
Internal Power Dissipation See Thermal Information
Differential Input Voltage ±1.2V
Input Common-Mode Voltage Range ±V
S
Storage Temperature Range: D –65°C to +125°C
Lead Temperature (soldering, 10s) +260°C
Junction Temperature (T
J
) +150°C
ESD Rating:
Human Body Model (HBM)
(2)
1500V
Charge Device Model (CDM) 1000V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operations of the device at these and any other conditions
beyond those specified is not supported.
(2) Pin 2 for the SO-8 package > 500V HBM. Pin 4 for the SOT23-6 package > 500V HBM.
Figure 1. PIN CONFIGURATION
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