Datasheet

ABSOLUTE MAXIMUM RATINGS
(1)
1
2
3
4
8
7
6
5
I
Q
Adjust
E
B
V
−
=
−
5V
C
V+ = +5V
Out
In
+1
Top View SO
OPA860
SBOS331C – JUNE 2005 – REVISED AUGUST 2008 ....................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT MEDIA,
PRODUCT PACKAGE DESIGNATOR RANGE MARKING NUMBER QUANTITY
OPA860ID Rails, 75
OPA860 SO-8 D – 45 ° C to +85 ° C OPA860
OPA860IDR Tape and Reel, 2500
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
Power Supply ± 6.5V
DC
Internal Power Dissipation See Thermal Information
Differential Input Voltage ± 1.2V
Input Common-Mode Voltage Range ± V
S
Storage Temperature Range: D – 65 ° C to +125 ° C
Lead Temperature (soldering, 10s) +300 ° C
Junction Temperature (T
J
) +150 ° C
ESD Rating:
Human Body Model (HBM)
(2)
1500V
Charge Device Model (CDM) 1000V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress Ratings only, and functional operations of the device at these and any other conditions
beyond those specified is not supported.
(2) Pin 2 > 500V HBM.
PIN CONFIGURATION
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