Datasheet

OPA836
OPA2836
SLOS712E –JANUARY 2011–REVISED SEPTEMBER 2013 www.ti.com
Layout Recommendations
The OPA836 EVM (SLOU314) should be used as a reference when designing the circuit board. It is
recommended to follow the EVM layout of the external components near to the amplifier, ground plane
construction, and power routing as closely as possible. General guidelines are:
1. Signal routing should be direct and as short as possible into an out of the op amp.
2. The feedback path should be short and direct avoiding vias if possible especially with G = +1.
3. Ground or power planes should be removed from directly under the amplifier’s negative input and output
pins.
4. A series output resistor is recommended to be placed as near to the output pin as possible. See
“Recommended Series Output Resistor vs. Capacitive Load” () for recommended values given expected
capacitive load of design.
5. A 2.2 µF power supply decoupling capacitor should be placed within 2 inches of the device and can be
shared with other op amps. For spit supply, a capacitor is required for both supplies.
6. A 0.1 µF power supply decoupling capacitor should be placed as near to the power supply pins as possible.
Preferably within 0.1 inch. For split supply, a capacitor is required for both supplies.
7. The PD pin uses TTL logic levels. If not used it should tied to the positive supply to enable the amplifier. If
used, it must be actively driven. A bypass capacitor is not necessary, but can be used for robustness in noisy
environments.
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REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (October 2011) to Revision E Page
• Added OPA2836 RMC package to document ...................................................................................................................... 1
• Added RMC package to second bullet in Description section .............................................................................................. 1
• Deleted Packaging/Ordering Information table, leaving only note to POA ........................................................................... 2
• Added OPA2836 RMC package to Thermal Information table ............................................................................................. 2
• Added OPA2839 RMC designator to OPA2836 RUN pin out diagram ................................................................................ 9
• Added OPA2836 RMC pin definitions to Pin Functions table ............................................................................................. 11
Changes from Revision A (March 2011) to Revision B Page
• Changed OPA836 from product preview to production data ................................................................................................ 1
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