Datasheet

OPA835
OPA2835
SLOS713E –JANUARY 2011–REVISED JULY 2013 www.ti.com
Layout Recommendations
OPA835 EVM (SLOU314) should be used as a reference when designing the circuit board. It is recommended to
follow the EVM layout of the external components near to the amplifier, ground plane construction, and power
routing as closely as possible. General guidelines are:
1. Signal routing should be direct and as short as possible into an out of the op amp.
2. The feedback path should be short and direct avoiding vias if possible especially with G = +1.
3. Ground or power planes should be removed from directly under the amplifier’s negative input and output
pins.
4. A series output resistor is recommended to be placed as near to the output pin as possible. See
“Recommended Series Output Resistor vs. Capacitive Load” (Figure 41) for recommended values given
expected capacitive load of design.
5. A 2.2 µF power supply decoupling capacitor should be placed within 2 inches of the device and can be
shared with other op amps. For spit supply, a capacitor is required for both supplies.
6. A 0.1 µF power supply decoupling capacitor should be placed as near to the power supply pins as possible.
Preferably within 0.1 inch. For split supply, a capacitor is required for both supplies.
7. The PD pin uses TTL logic levels. If not used it should tied to the positive supply to enable the amplifier. If
used, it must be actively driven. A bypass capacitor is not necessary, but can be used for robustness in noisy
environments.
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REVISION HISTORY
Changes from Revision D (October 2011) to Revision E Page
• Added RMC package to document ....................................................................................................................................... 1
• Added RMC package option to Description section ............................................................................................................. 1
• Added RMC to Package/Ordering Information table ............................................................................................................ 2
• Added RMC to Thermal Information table ............................................................................................................................ 2
• Added RMC designator to OPA2835 RUN pin out diagram ................................................................................................. 9
• Added RMC pin definitions to Pin Functions table ............................................................................................................. 10
Changes from Revision A (March 2011) to Revision B Page
• Changed OPA835 from product preview to production data ................................................................................................ 1
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