Datasheet

OPA827
SBOS376H –NOVEMBER 2006–REVISED MAY 2012 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING
Standard Grade
OPA827AI SO-8 D OPA827A
OPA827AI MSOP-8 DGK NSP
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted).
PARAMETER VALUE UNIT
Supply Voltage V
S
= (V+) – (V–) 40 V
Input Voltage
(2)
(V–) – 0.5 to (V+) + 0.5 V
Input Current
(2)
±10 mA
Differential Input Voltage ±V
S
V
Output Short-Circuit
(3)
Continuous
Operating Temperature T
A
–55 to +150 °C
Storage Temperature T
A
–65 to +150 °C
Junction Temperature T
J
+150 °C
Human Body Model (HBM) 4000 V
ESD Ratings
Charged Device Model (CDM) 1000 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should
be current-limited to 10mA or less.
(3) Short-circuit to V
S
/2 (ground in symmetrical dual-supply setups).
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