Datasheet
"#$
SBOS303C − JUNE 2004 − REVISED AUGUST 2008
www.ti.com
2
ABSOLUTE MAXIMUM RATINGS
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Power Supply ±6.5V
DC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Power Dissipation See Thermal Information. . . . . . . . . . . .
Differential Input Voltage ±1.2V. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Common-Mode Voltage Range ±V
S
. . . . . . . . . . . . . . . . . . . .
Storage Temperature Range −65°C to +125°C. . . . . . . . . . . . . . . . .
Lead Temperature (soldering, 10s) +300°C. . . . . . . . . . . . . . . . . . . .
Junction Temperature (T
J
) +150°C. . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD Rating
Human Body Model (HBM) +3000V. . . . . . . . . . . . . . . . . . . . . .
Charge Device Model (CDM) +1000V. . . . . . . . . . . . . . . . . . . .
Machine Model (MM) +300V. . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
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PRODUCT PACKAGE-LEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
OPA820 SO-8 D −45°C to +85°C OPA820 OPA820ID Rails, 100
″ ″ ″ ″ ″ OPA820IDR Tape and Reel, 2500
OPA820 SOT23-5 DBV −45°C to +85°C NSO OPA820IDBVT Tape and Reel, 250
″ ″ ″ ″ ″ OPA820IDBVR Tape and Reel, 3000
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For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI web
site at www.ti.com.
PIN CONFIGURATION
TOP VIEW SO TOP VIEW SOT
1
2
3
4
8
7
6
5
NC
+V
S
Output
NC
NC
Inverting Input
Noninverting Input
−
V
S
NC = No Connection
1
2
3
5
4
+V
S
Inverting Input
Output
−
V
S
Noninverting Inut
NSO
1
2
3
5
4
Pin Orientation/Package Marking