Datasheet
OPA699
2
SBOS261D
www.ti.com
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY
OPA699 SO-8 D –40°C to +85°C OPA699ID OPA699ID Rails, 100
"" " ""OPA699IDR Tape and Reel, 2500
Supply Voltage ................................................................................. ±6.5V
Internal Power Dissipation........................... See Thermal Characteristics
Input Voltage Range............................................................................ ±V
S
Differential Input Voltage ..................................................................... ±V
S
Limiter Voltage Range ........................................................... ±(V
S
– 0.7V)
Storage Temperature Range: D ..................................... –65°C to +125°C
Lead Temperature (SO-8, soldering, 3s) ...................................... +260°C
Junction Temperature .................................................................... +150°C
ESD Resistance: HBM .................................................................... 2000V
MM ........................................................................ 200V
CDM ................................................................... 1000V
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability.
PIN CONFIGURATION
Top View SO
ABSOLUTE MAXIMUM RATINGS
(1)
PACKAGE/ORDERING INFORMATION
(1)
SINGLES DUALS DESCRIPTION
Output Limiting OPA698 Unity Gain Stable, Wideband
Voltage Feedback OPA690 OPA2690 High Slew, Unity Gain Stable
RELATED PRODUCTS
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
1
2
3
4
8
7
6
5
NC
Inverting Input
Noninverting Input
–V
S
V
H
+V
S
Output
V
L
NC = No Connection
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this document, or see the TI website
at www.ti.com.