Datasheet

OPA698
2
SBOS258D
www.ti.com
SINGLES DUALS DESCRIPTION
Output Limiting OPA699 High Gain BW, Non-unity
Gain Stable
Voltage Feedback OPA690 OPA2690 High Slew, Unity Gain Stable
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY
OPA698 SO-8 Surface Mount D –40°C to +85°C OPA698ID OPA698ID Rails, 100
"" " ""OPA698IDR Tape and Reel, 2500
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage ............................................................................. ±6.5V
DC
Internal Power Dissipation .......................... See Thermal Characteristics
Common-Mode Input Voltage ............................................................. ±V
S
Differential Input Voltage ..................................................................... ±V
S
Limiter Voltage Range ........................................................... ±(V
S
– 0.7V)
Storage Temperature Range: ID ....................................–65°C to +125°C
Lead Temperature (SO-8, soldering, 3s) ...................................... +260°C
ESD Resistance: HBM .................................................................... 2000V
MM ........................................................................ 200V
CDM .................................................................... 1000V
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability.
PIN CONFIGURATION
Top View SO
1
2
3
4
NC = Not Connected
8
7
6
5
NC
Inverting Input
Noninverting Input
–V
S
V
H
+V
S
Output
V
L
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
(1)
RELATED PRODUCTS
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this document, or see the TI website
at www.ti.com.