Datasheet

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OPA653
www.ti.com SBOS348A –DECEMBER 2008–REVISED NOVEMBER 2009
For proper operation, the PowerPAD must be tied to For more general data and detailed information about
the most negative supply voltage. It is recommended the PowerPAD package, refer to the PowerPAD™
to use five evenly-spaced vias under the device as Thermally Enhanced Package application note
shown in the EVM layer views (see Figure 27). (SLMA002).
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EVALUATION MODULE
Schematic and PCB Layout
Figure 26 is the OPA653EVM schematic. Layers 1 through 4 of the PCB are shown in Figure 27. It is
recommended to follow the layout of the external components near to the amplifier, ground plane construction,
and power routing as closely as possible.
Figure 26. OPA653EVM Schematic
Figure 27. OPA653EVM PCB Layers 1 through 4
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Product Folder Link(s): OPA653