Datasheet

PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
OPA602AM OBSOLETE TO-99 LMC 8 TBD Call TI Call TI
OPA602AM2 OBSOLETE TO-99 LMC 8 TBD Call TI Call TI
OPA602AP ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br)
CU NIPDAU N / A for Pkg Type
OPA602APG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br)
CU NIPDAU N / A for Pkg Type
OPA602AU ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA602AU/2K5 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA602AU/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA602AUE4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA602AUG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA602BM OBSOLETE TO-99 LMC 8 TBD Call TI Call TI
OPA602BM1 OBSOLETE TO-99 LMC 8 TBD Call TI Call TI
OPA602BP ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br)
CU NIPDAU N / A for Pkg Type
OPA602BPG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br)
CU NIPDAU N / A for Pkg Type
OPA602CM OBSOLETE TO-99 LMC 8 TBD Call TI Call TI
OPA602SM OBSOLETE TO-99 LMC 8 TBD Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
PACKAGE OPTION ADDENDUM
www.ti.com 26-Oct-2009
Addendum-Page 1