Datasheet

OPA569
SBOS264A
2
www.ti.com
PIN # NAME DESCRIPTION
1, 10, 11, 20 PowerPAD PowerPAD Connection Pins
2 Parallel Out 1 Connection for Paralleling Multiple
Amplifiers
3 Current Limit Set Current Limit Set Pin
4 Current Limit Flag Indicates When Part is in Current
Limit (Active LOW).
5 –In Inverting Input
6 +In Noninverting Input
7 Thermal Flag Indicates Thermal Stress (Active
LOW)
8 Enable Enabled HIGH. Shut down LOW.
9 Parallel Out 2 Connection for Paralleling Multiple
Amplifiers
12, 13 V+ Positive Power-Supply Voltage
14, 15 V
O
Output
16 NC No Internal Connection
17, 18 V– Negative Power-Supply Voltage
19 I
MONITOR
Provides 1:475 Bidirectional Copy
of Output Current.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper han-
dling and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
Supply Voltage ................................................................................. +7.5V
Output Current ............................................................... See SOA Curves
Signal Input Terminals (pins 2, 5, 6, and 9):
Voltage
(2)
............................................... (V–) – 0.5V to (V+) + 0.5V
Current
(2)
................................................................................ ±10mA
Output Short-Circuit
(3)
........ Continuous when thermal protection enabled
Current Monitor (pin 19) Short-Circuit..................................... Continuous
Enable Pin (pin 8) .......................................... (V–) – 0.5V to (V–) + 7.5V
PowerPAD (pins 1, 10, 11, 20, and pad) ...... (V–) – 0.5V to (V–) + 0.5V
Current Limit Set (pin 3)................................. (V–) – 0.5V to (V+) + 0.5V
Operating Temperature ..................................................–55°C to +125°C
Storage Temperature ..................................................... –65°C to +150°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may de-
grade device reliability. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those specified is
not implied. (2) Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.5V beyond the supply rails should
be current limited to 10mA or less. (3) Short-circuit to ground.
PIN CONFIGURATION
PACKAGE/ORDERING INFORMATION
ABSOLUTE MAXIMUM RATINGS
(1)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
PowerPAD
(1)
Parallel Out 1
Current Limit Set
Current Limit Flag
–In
+In
Thermal Flag
Enable
Parallel Out 2
PowerPAD
(1)
PowerPAD
(1)
I
MONITOR
V–
(3)
V–
(3)
NC
(2)
V
O
(3)
V
O
(3)
V+
(3)
V+
(3)
PowerPAD
(1)
OPA569
Metal
PowerPAD
Heat Sink
(Located
on
bottom
side)
NOTES: (1) PowerPAD pins 1, 10, 11, and 20 and the
PowerPAD should be connected to the most negative
supply (V–) in either single or split supply configurations.
(2) NC means no internal connection.
(3) The following pin pairs must be connected together:
12 and 13; 14 and 15; 17 and 18.
Top View SO
PIN DESCRIPTIONS
For the most current package and ordering information, see
the Package Option Addendum located at the end of this
data sheet.