Datasheet

OPA541
2
SBOS153A
www.ti.com
Top View TO–3
Plastic Package
CONNECTION DIAGRAMS
−In
NC
+In NC
V
O
Output
Drive
R
CL
−V
S
+V
S
Current
Sense
1357911
246810
Tab at −V
S
. Do not use to conduct current.
Current
Sense
–V
S
+In
–In
+V
S
NC
NC
Output
Drive
R
CL
V
O
1
2
3
8
5
6
4
7
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage, +V
S
to –V
S
............................................................... 80V
Output Current ............................................................................. see SOA
Power Dissipation, Internal
(2)
.......................................................... 125W
Input Voltage: Differential .................................................................... ±V
S
Common-mode ............................................................ ±V
S
Temperature: Pin solder, 10s ........................................................ +300°C
Junction
(2)
............................................................... +150°C
Temperature Range:
AM, BM SM
Storage ..................................................................... –65°C to +150°C
Operating (case) .......................................................–55°C to +125°C
AP
Storage ....................................................................... –40°C to +85°C
Operating (case) ......................................................... –25°C to +85°C
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
For the most current package and ordering information, see
the Package Option Addendum at the end of this document,
or see the TI website at www.ti.com.
PACKAGE/ORDERING INFORMATION
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. (2) Long term operation at the maximum junction temperature
will result in reduced product life. Derate internal power dissipation to achieve
high MTTF.