Datasheet

THERMALLY-ENHANCED PowerPAD
MoldCompound(Plastic)
LeadframeDiePad
ExposedatBaseofthePackage
(CopperAlloy)
Leadframe(CopperAlloy)
IC(Silicon)
DieAttach(Epoxy)
a)SO-8PowerPADcross-sectionview.
OPA454
SBOS391A – DECEMBER 2007 – REVISED DECEMBER 2008 ....................................................................................................................................... www.ti.com
plated-through holes (vias) provide a low thermal
PACKAGE resistance heat flow path to the back side of the PCB.
This architecture enhances the OPA454 power
The OPA454 comes in an SO-8 PowerPAD version
dissipation capability significantly, eliminates the use
that provides an extremely low thermal resistance
of bulky heatsinks and slugs traditionally used in
( θ
JC
) path between the die and the exterior of the
thermal packages, and allows the OPA454 to be
package. This package features an exposed thermal
easily mounted using standard PCB assembly
pad. This thermal pad has direct thermal contact with
techniques. NOTE: Because the SO-8 PowerPAD is
the die; thus, excellent thermal performance is
pin-compatible with standard SO-8 packages, the
achieved by providing a good thermal path away from
OPA454 is a drop-in replacement for operational
the thermal pad.
amplifiers in existing sockets. Soldering the
PowerPAD to the PCB is always required, even with
The OPA454 SO-8 PowerPAD is a standard-size
applications that have low power dissipation.
SO-8 package constructed using a downset
Soldering the device to the PCB provides the
leadframe upon which the die is mounted, as
necessary thermal and mechanical connection
Figure 71 shows. This arrangement results in the
between the leadframe die pad and the PCB.
lead frame being exposed as a thermal pad on the
underside of the package. The thermal pad on the
bottom of the IC can then be soldered directly to the
PCB, using the PCB as a heatsink. In addition,
Figure 71. Cross-Section View of a PowerPAD Package
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Product Folder Link(s): OPA454