Datasheet

ABSOLUTE MAXIMUM RATINGS
(1)
PIN ASSIGNMENT
1
2
3
4
8
7
6
5
E/D(Enable/Disable)
V+
OUT
StatusFlag
E/DCom(Enable/DisableCommon)
-IN
+IN
V-
PowerPAD
HeatSink
(Locatedon
bottomside)
(1)
OPA454
SBOS391A – DECEMBER 2007 – REVISED DECEMBER 2008 ....................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING
OPA454 SO-8 DDA OPA454
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
OPA454 UNIT
Supply Voltage V
S
= (V+) – (V – ) 120 V
Signal Input Terminals, Voltage
(2)
(V – ) – 0.3 to (V+) + 0.3 V
Signal Input Terminals, Current
(2)
± 10 mA
E/D to E/D Com Voltage +5.5 V
Output Short-Circuit
(3)
I
SC
Continuous
Operating Temperature T
J
– 55 to +125 ° C
Storage Temperature – 55 to +125 ° C
Junction Temperature T
J
+150 ° C
Human Body Model (HBM) 4000 V
ESD Rating: Charged Device Model (CDM) 500 V
Machine Model (MM) 150 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should
be current limited to 10mA or less.
(3) Short-circuit to ground.
DDA PACKAGE
SO-8 PowerPAD
(TOP VIEW)
(1) PowerPAD is internally connected to V – . Soldering the PowerPAD to the printed circuit board (PCB) is always
required, even with applications that have low power dissipation.
2 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): OPA454