Datasheet
3
®
OPA4243
Supply Voltage, V+ to V– .................................................................... 36V
Input Voltage Range
(2)
................................... (V–) – 0.3V to (V+) + 0.3V
Input Current
(2)
................................................................................. 10mA
Output Short-Circuit
(3)
.............................................................. Continuous
Operating Temperature ..................................................–55°C to +125°C
Storage Temperature ..................................................... –65°C to +150°C
Junction Temperature ...................................................................... 150°C
Lead Temperature (soldering, 10s) ................................................. 300°C
ESD Capability ................................................................................ 2000V
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. (2) Inputs are diode-clamped to the supply rails and should
be current-limited to 10mA or less if input voltages can exceed rails by more
than 0.3V. (3) Short-circuit to ground, one amplifier per package.
ABSOLUTE MAXIMUM RATINGS
(1)
PACKAGE/ORDERING INFORMATION
PACKAGE SPECIFIED
DRAWING TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE NUMBER RANGE MARKING NUMBER
(1)
MEDIA
OPA4243EA TSSOP-14 357 –40°C to +85°C OPA4243EA OPA4243EA/250 Tape and Reel
"""""OPA4243EA/2K5 Tape and Reel
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces
of “OPA4243EA” will get a single 2500-piece Tape and Reel.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.