Datasheet
4
®
OPA404
DICE INFORMATION
PAD FUNCTION
8 Output C
9 –Input C
10 +Input C
11 –V
CC
12 +Input D
13 –Input D
14 Output D
PAD FUNCTION
1 Output A
2 –Input A
3 +Input A
4+V
CC
5 +Input B
6 –Input B
7 Output B
MECHANICAL INFORMATION
MILS (0.001") MILLIMETERS
Die Size 108 x 108 ±5 2.74 x 2.74 ±0.13
Die Thickness 20 ±3 0.51 ±0.08
Min. Pad Size 4 x 4 0.10 x 0.10
Backing None
Substrate Bias: –V
CC
NC: No connection
12
3
4
NC
89
10
11
NC
12
NC
13
14
NC
NC
5
6
7
NC
OPA404 DIE TOPOGRAPHY
TYPICAL PERFORMANCE CURVES
T
A
= +25°C, V
CC
= ±15VDC unless otherwise noted.
1 10 100 1k 10k 100k 1M
Frequency (Hz)
0.1
100
10
1
Current Noise (fA/ Hz)
INPUT CURRENT NOISE SPECTRAL DENSITY
100 1k 10k 100k 1M 10M 100M
Source Resistance ( )
1
1k
100
10
Voltage Noise, E
O
(nV/ Hz)
TOTAL INPUT VOLTAGE NOISE SPECTRAL DENSITY
AT 1kHz vs SOURCE RESISTANCE
Ω
OPA404 + Resistor
E
O
S
R
Resistor noise only
–75 –50 0 +25 +50 +100 +125
Temperature (°C)
90
110
105
95
CMR and PSR (dB)
POWER SUPPLY REJECTION AND COMMON-MODE
REJECTION vs TEMPERATURE
100
–25 +75
PSR
CMR
–50 +25–25 0 +50 +75 +100 +125
Ambient Temperature (°C)
0.1
1
10
100
1nA
10nA
Bias Current (pA)
BIAS AND OFFSET CURRENT
vs TEMPERATURE
0.1
1
10
100
1nA
10nA
Offset Current (pA)
Bias Current
Offset Current